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Ceramic 3D Printing Services

Additive manufacturing solutions for advanced ceramics: complex structures formed in one piece, breaking through traditional process limitations.

Technical Overview

Shanghai Shuzao uses advanced SLA ceramic 3D printing technology. Ceramic powder is mixed with photopolymer resin to create a ceramic slurry, which is precisely cured by UV laser and then defatted and sintered to produce dense ceramic parts.

This technology overcomes the limitations of traditional ceramic forming processes, enabling direct manufacturing of high-precision ceramic parts with complex geometries, micro-pores, thin walls, and internal flow channels. It is widely used in semiconductor, electronics & electrical, aerospace, and chemical energy sectors.

±0.1%
Dimensional Accuracy
1700℃
Maximum operating temperature
Ceramic 3D Printing Equipment

Available ceramic materials

Offer a range of high-performance ceramic materials to meet diverse application needs.

Zirconia Ceramic (ZrO₂)

Zirconia Ceramic (ZrO₂)

Density
6.0 g/cm³
Flexural Strength
≥900 MPa
Temperature resistance
Temperature tolerance: 1200°C

Material Properties:

High IntensityHigh ResilienceWear-resistantGood biocompatibility

Typical Applications:

Denture RestorationOrthopedic ImplantsPrecision Mechanical PartsKnivesJewelry
Alumina Ceramic (Al₂O₃)

Alumina Ceramic (Al₂O₃)

Density
3.9 g/cm³
Flexural Strength
≥380 MPa
Temperature resistance
Temperature tolerance: 1600°C

Material Properties:

High HardnessGood insulationCorrosion-resistantCost-effective

Typical Applications:

Electronic SubstrateInsulating partsChemical-resistant componentsMedical DevicesGrinding Media
Silicon Carbide Ceramic (SiC)

Silicon Carbide Ceramic (SiC)

Density
3.1 g/cm³
Flexural Strength
≥450 MPa
Temperature resistance
Temperature tolerance: 1700°C

Material Properties:

Ultra-HardHigh thermal conductivitylow thermal expansionantioxidant

Typical Applications:

Semiconductor Wafer CarrierMirror substrateHigh-temperature heat exchangerBallistic CeramicSpace Optics
Hydroxyapatite (HA)

Hydroxyapatite (HA)

Density
3.16 g/cm³
Flexural Strength
≥100 MPa
Temperature resistance
Sintering temperature 1100°C

Material Properties:

bioactivityConsistent with human bone compositionbiodegradableBone conduction

Typical Applications:

Bone defect repair scaffoldTissue engineering scaffoldsOral and Maxillofacial Prosthodonticsartificial discBiomedical Research

Print Case

Successful Applications of Ceramic 3D Printing Across Multiple Industries

Ceramic fingers for the semiconductor industry

Ceramic Fingers for the Semiconductor Industry

semiconductor
Challenge:

Traditional cold isostatic pressing (CIP) processes have lead times exceeding 6 weeks, long design validation cycles, and high mold costs.

Solution:

Utilize the 3DCR series ceramic 3D printer with high-purity alumina slurry (Al₂O₃ purity ≥ 99.5%) to directly fabricate complex internal airflow channel structures.

Results:

Lead time reduced from 6 weeks to 12 days; suction test passed. Customer feedback: "Faster and internal airflow channels meet functional requirements."

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Ceramic cores for aero engines

Ceramic Cores for Aero Engines

Aerospace
Challenge:

Traditional manufacturing of complex internal cooling channels in turbine blades involves laborious processes, with lead times ranging from 4 to 6 weeks and mold costs reaching $20,000–$30,000.

Solution:

SLA photopolymerization ceramic 3D printing directly forms ceramic cores without mold making; uses alumina ceramic slurry with a temperature resistance of 1600°C.

Results:

Development cycle shortened from 6 weeks to 10 days; unit cost reduced from 5000 yuan to 1800 yuan, a 64% decrease.

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Special-shaped ceramic terminal blocks

Special-shaped Ceramic Terminal Blocks

New Energy
Challenge:

EV battery packs and PV inverters require high-temperature-resistant, high-insulation custom ceramic terminal blocks; traditional dry pressing can only produce simple shapes.

Solution:

SLA photopolymerization ceramic 3D printing uses alumina-based slurry (Al₂O₃ content ≥85%) to directly form complex curved surfaces, micro-pores, and precision features like slots.

Results:

Reduced the development cycle for custom ceramic terminal blocks from 3-6 months to 2 weeks, and lowered unit cost from 500 yuan to 150 yuan.

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Technical Advantages

3D printing technology delivers a revolutionary breakthrough compared to traditional ceramic manufacturing processes.

High-precision molding

Layer thickness: 0.05mm; dimensional accuracy: ±0.1%; capable of forming 3D micro-holes as thin as 0.3mm and complex structures with walls as thin as 0.5mm

High-temperature resistance

Sintered ceramic components withstand temperatures up to 1700°C, making them ideal for extreme high-temperature applications.

Excellent electrical performance

Dielectric strength ≥ 18kV/mm, low dielectric constant; ideal for electronic and electrical applications.

High mechanical strength

Bending strength ≥ 380MPa, hardness HRA ≥ 85, excellent wear resistance, and long service life

Biocompatibility

Zirconia and hydroxyapatite are certified biocompatible for direct use in medical implants.

Corrosion Resistance

Resistant to acid and alkali corrosion; ideal for harsh environments such as chemical processing and marine applications.

Quality Metrics

Rigorous quality control system ensures superior performance for every ceramic component.

±0.1%
Dimensional Accuracy
Precise Control of Post-Sintering Shrinkage
Ra ≤ 1.6 μm
Surface Roughness
Sintered Surface Quality
≥96%
Density
Post-sintering material density
0.5mm
Minimum Wall Thickness
Minimum formable wall thickness
≥0.3mm
Minimum Aperture
Formable Micro-pore Size
7-15 days
Lead Time
From design to finished product delivery

Application Areas

Ceramic 3D printing technology is widely used across multiple high-end manufacturing sectors.

Semiconductor Industry

Leverage ceramics' high purity, heat resistance, and corrosion resistance to meet stringent semiconductor manufacturing requirements.

Wafer CarrierElectrostatic ChuckCavity ComponentInsulating Ring

Electrical and Electronic

Leverages ceramic's high insulation and heat resistance for high-voltage, high-temperature electrical environments.

Ceramic SubstrateInsulating partsterminal blockSensor housing

Aerospace

Leverage ceramics' lightweight, high-temperature resistance, and thermal shock resistance to meet extreme operating conditions.

Engine componentsthermal protection tilesOptical MirrorSensor window

Chemical Energy

Leverages ceramic's acid and alkali corrosion resistance; ideal for chemical, petroleum, and new energy sectors.

Corrosion-resistant pump componentssealing ringCatalyst Supportbattery separator

Service Process

Standardized six-step service process to ensure efficient, high-quality project delivery.

01

Requirement Assessment

Understand application scenarios, performance requirements, and accuracy standards to recommend suitable ceramic materials and process solutions.

02

Design Optimization

Optimize 3D model design for ceramic process characteristics to ensure printability and final performance.

03

Print Formed

Utilizes SLA photopolymerization ceramic 3D printing technology to precisely form complex green body structures.

04

defatted sintering

Professional sintering furnace high-temperature treatment to remove resin carriers and produce dense ceramic parts.

05

Post-processing

Perform post-processing such as grinding, polishing, and metallization as needed to meet final precision requirements.

06

Quality Inspection

Dimensional inspection, performance testing, and non-destructive testing to ensure product quality meets standards.

Professional Team and Equipment

Shanghai Shuzao boasts a professional team with over 10 years of experience in ceramic material R&D. Equipped with multiple industrial-grade ceramic 3D printers, high-temperature sintering furnaces, and precision testing instruments, we provide one-stop services from design optimization to final delivery.

10+ years
Ceramic material R&D experience
50+ items
Ceramic Printing Patent Technology
7-15 days
Standard Lead Time
Ceramics Technology Team

Technical Comparison

Ceramic 3D Printing vs. Traditional Methods: A Comprehensive Performance Comparison

Comparison CriteriaCeramic 3D PrintingConventional Injection MoldingCNC Machining
Complex StructureSeamlessly molded, limitless.Limited by draft angleTool accessibility limitations
Development Cycle1-7 days (no mold required)30-60 days (mold required)7-15 days
Small-batch costLow (No Mold Fee)High (high mold cost)Medium
Material Utilization Rate≥95%60-70%30-50%
Minimum Wall Thickness0.5mm1.0mm0.8mm
Surface QualityRa ≤ 1.6 μm (as-sintered)Ra ≤ 0.8 μmRa ≤ 0.4 μm
Customization flexibilityVery High (varies by item)Low (Mold Fixed)Medium

Success Stories

Successful Applications of Ceramic 3D Printing Across Multiple Industries

Custom Dental Zirconia Crowns

Custom Dental Zirconia Crowns

Semiconductor Industry
Challenge:

Traditional craftsmanship struggles to achieve precise, personalized crown matching and requires a long production cycle.

Solution:

Fabricate personalized crowns using zirconia ceramic 3D printing, directly from patient intraoral scan data.

Results:

Accuracy ±0.05mm; production time reduced from 7 to 2 days; patient satisfaction increased by 40%

Aerospace Ceramic Sensor Window

Aerospace Ceramic Sensor Window

Aerospace
Challenge:

Transparent, heat-resistant sensor protection windows for high-temperature environments come at a high cost with traditional manufacturing.

Solution:

Manufacture complex-curve sensor windows from aluminum oxide ceramic via 3D printing in a single piece, eliminating the need for拼接.

Results:

Temperature resistance: 1600°C, Light transmittance ≥85%, Cost reduced by 50%, Weight reduced by 30%

Semiconductor Wafer Carrier Manufacturing

Semiconductor Wafer Carrier Manufacturing

Electrical and Electronic
Challenge:

Silicon carbide wafer carriers require ultra-high purity and precise dimensions, making traditional machining challenging.

Solution:

Utilize silicon carbide ceramic 3D printing to directly form complex internal flow channel structures.

Results:

Purity ≥99.9%, dimensional accuracy ±0.1%, service life extended 3x

Customized Orthopedic Implants

Customized Orthopedic Implants

Semiconductor Industry
Challenge:

Significant variability in patient bone anatomy results in low compatibility with standardized implants.

Solution:

Personalized Hydroxyapatite Bone Repair Scaffold Designed from CT Data with Precision 3D Printing

Results:

60% increase in osseointegration rate, 40% shorter surgery time, 30% reduced recovery period

Get Ceramic 3D Printing Solutions

Submit your requirements, and our ceramic technology experts will provide you with a customized solution and detailed quote within 24 hours.

Contact Us
Shanghai ICP License No. 19015893-1